Open Access Journal

ISSN : 2456-1290 (Online)

International Journal of Engineering Research in Computer Science and Engineering (IJERCSE)

Monthly Journal for Computer Science and Engineering

Open Access Journal

International Journal of Engineering Research in Mechanical and Civil Engineering (IJERMCE)

Monthly Journal for Mechanical and Civil Engineering

ISSN : 2456-1290 (Online)

Mechanical Modeling and Testing of 3D Printed Material

Author : Hemanth B R 1 Mahendra Babu K J 2 Swarnakiran S 3

Date of Publication :25th May 2018

Abstract: Fused Deposition Modeling (FDM) is one of the best 3-D printing techniques, where specimen is built as layer by layer deposition from the extruded filaments of melted thermoplastic. Layer orientation plays an important role in surface finish, dimensionality and mechanical behavior. Present work is an attempt to determine the tensile strength, Young’s modulus and fracture strain of the 3-D printed model built by using raster fill method according to ASTM D638 standards. The tensile strength and modulus were shown to vary based on the build orientation of identical test specimen. Fractured surface of the surface shows the 3D printed material behaves more like composite structures. Strain gauges were used to measure the uniform strain during the tensile testing. Numerical Modeling of the tensile set up was done in ABAQUS to replicate experimental results

Reference :

  1. L. Villalpando, H. Eiliat, R. J. Urbanic, 2014, An optimization approach for components built by fused deposition modeling with parametric internal structures, CIRP Industrial product- service, 800-805. 

    Wohlers Associates/ Last access 28.06.2010:http://http://www.wohlersassociates.com/JanFeb10TC.htm

    A. Bagsik, V. Schoppner, E. Klemp, 2010, FDM Part Quality Manufactured with Ultem 9085, Polymeric Materials, Halle (saale). 

    A.S. El-Gizawy, S. Corl, B. Graybill, Process-induced properties of FDM products, in: Proceedings of the ICMET, International Conference on Mechanical Engineering’s and Technology Congress & Exposition, 2011


Recent Article