Date of Publication :7th November 2016

Abstract: Power amplifier is a device which amplifies the signal of communicating device. Thermal analysis was done on the key Componentsof the power amplifier in orderto dissipate maximum heat from the device. The heat input was given to keyComponents i.e. MR (TRANSISTOR) PA COMPONENT of the amplifier ,located on the PCB with a capacity around 195W .Remaining amount of heat distribution was on other components and analysis was done to measure the maximum temperature ofthe components through “SOLID WORKS SOFTWARE ". Three analyses were done in order to achieve optimum operating temperature of maximum heat dissipatingcomponents. First, each part of the power amplifier device was modeled and then assembled. After the assembly, thermal analysis was done on the device with 25 fins. Themaximumtemperature of heat dissipating component was around 225 Degree Celsius much higher than the operating junction temperature of the component which is 150 Degree Celsius;hence this design was not acceptable. During second analysis, in order to minimize the temperature of maximum heat dissipating device less than the operating junction temperature number offins were increased from 25 to 30 .Analysis done with this modification gave the resulting temperatures as165.417Degree Celsius. During third analysis, in which the number of the fins remained samebuta cutout given to the PCB and device mounted on inner surface of the housing. As a result the thermal resistance(K/ L) reduced which allowed more heat dissipation and resulted in minimizing the temperature under the given operating conditions.The temperature measured was around 126.7 Degree Celsius. Hence, design was acceptable. This helps the device to runefficiently for definite time period.

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